Just recently, The Xbox boss Phil Spencer revealed the Xbox Series X SoC. Sharing a similar architecture to its Xbox One X predecessor, this new SoC is far more powerful. Advertises a large 8K at the bottom left corner, as well as a “Project Scarlett” in the right lower corner.
As recently reported the die size of the chip is quite large, Microsoft’ Project Scarlett will feature RDNA 2.0 architecture, this boast an 7nm technology. Expecting to deliver 12GB GDDR6 memory and 672GB/s bandwith, the Microsoft Series X looks a solid option for those who are interested in 8K gaming.
Techpowerup released an image of the leaked specification of the Xbox Series X ‘S GPU. Take a look at it down below:
The Project Scarlett die is rumored to be around 350 mm² consisting on 14.500 million transistors. This enables the next generation console to deliver around 12 teraflops within a modest 180W TDP setup.
Phil Spencer still hasn’t revealed any specification on the hardware, as he only revealed an image of the chip, techpowerup’s information is unofficial and must be taken with a grain of salt.
What’s confirmed about the next-gen Xbox Series X is that “will set a new bar for console power, speed and performance”. Will release on holidays 2020.
“With a custom-designed AMD processor, high bandwidth GDDR6 memory, and a next generation solid state drive (SSD), Project Scarlett will give developers the power they need to bring their creative visions to life. Thousands of games across four console generations will look and play best on Project Scarlett.”
The launch title will be the next installment of a franchise that is very much attached to the Xbox history, Halo Infinite.
Developed by 343 Industries for the entire Xbox family of devices, including Project Scarlett, “Halo Infinite continues the Halo 5: Guardians storyline and takes the franchise in ambitious and unexpected directions, powered by the all-new Slipspace Engine.”
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